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Tantalum Nitride (TaN)

Tantalum Nitride (TaN) has excellent physical, chemical and mechanical properties (such as high hardness, wear resistance, chemical inertness, thermal stability and low temperature coefficient of resistance), and is widely used in wear-resistant coatings, thin film resistors and integrated circuits Diffusion barriers and other fields in China.
Molecular weight: 194.9
Density:13.4g/m3
Colour:gray
Melting point:3090℃
Nitrogen content:≥6.8
Boiling point:4800℃
CAS NO.:12033-62-4
EINECS (EC NO.):234-788-4
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Tantalum Nitride (TaN)
Product Description
Tantalum Nitride (TaN) has excellent physical, chemical and mechanical properties (such as high hardness, wear resistance, chemical inertness, thermal stability and low temperature coefficient of resistance), and is widely used in wear-resistant coatings, thin film resistors and integrated circuits Diffusion barriers and other fields in China.

Product Features
1.High purity: the highest purity can reach 99.99%, XRD detect no impurity phase.
Technical Data
Model APS(D50) Purity(%) O(%) H(%) C(%) N(%)
TaN0800 0.5-1.0um >99.0 ≤1.0 ≤0.001 ≤0.01 6.5~7.2
TaN0020 1.0-3.0um >99.5 ≤.0.8 ≤0.001 ≤0.01 6.5~7.2
TaN0001 -325mesh >99.9 ≤0.1 ≤0.001 ≤0.001 6.5~7.2
Customized chemical composition and particle size can be made according to customer requirements.
 
Element Max Typical Element Max Typical Element Max Typical
Al 0.0010 0.0005 Fe 0.0500 0.0300 P 0.0010 0.0005
As 0.0010 0.0005 K 0.0020 0.0010 Pb 0.0003 0.0001
Bi 0.0003 0.0001 Mg 0.0020 0.0010 S 0.0010 0.0005
Ca 0.0015 0.0006 Mn 0.0010 0.0005 Sb 0.0020 0.0010
Cd 0.0005 0.0001 Mo 0.0030 0.0015 Si 0.0050 0.0030
Co 0.0005 0.0001 Na 0.0020 0.0005 Sn 0.0003 0.0001
Cr 0.0050 0.0020 Ni 0.0050 0.0030 Ti 0.0050 0.0020
Cu 0.0003 0.0001 Nb 0.0030 0.0010 V 0.0050 0.0010
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