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Copper silicide (Cu5Si)

Cu5Si is a kind of inter-metallic compound with properties between ionic compounds and alloys. It has excellent electrical conductivity, thermal conductivity, ductility, corrosion resistance and wear resistance.
Molecular weight:345.82
Formula: Cu5Si
Colour:gray
Melting point:825 °C
Boiling point:N/A
CAS NO.:12159-07-8
EINECS (EC NO.):235-286-8
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Copper silicide
Product Description
Cu5Si is a kind of inter-metallic compound with properties between ionic compounds and alloys. It has excellent electrical conductivity, thermal conductivity, ductility, corrosion resistance and wear resistance.
Copper silicide films can be used to passivate the copper based chips, inhibit diffusion and electron transport. And as diffusion barrier, copper silicide can also be directly used as organic silicon compounds in industry.
Product Features
1, High purity: XRD detected no impurity phase;
2. Concentrated distribution: standard normal distribution of particle size, no bimodal or multi-modal.
Technical Specification
Model Average Particle Size (D50) Purity(%) O(%) N(%) C(%) Si(%)
Cu5Si0008 -325mesh >99.9 ≤0.30 ≤0.05 ≤0.05 7.7~8.1
Customized chemical composition and particle size can be made according to customer requirements.
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